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The Jedec drop test has become a popular method for the assessment of the dynamic mechanical reliability of 2nd level assemblies. It delivers repeatable results and is thus well suited for the development of a virtual lifetime model based on FEM simulations. Detailed experimental studies showed PCB copper trace fractures as the dominating failure mode. The virtual risk assessment applied a two steps...
The solder joints reliability of electronic packages during board level drop impact is a great concern for semiconductor manufacturers. Many researchers have adopted numerical simulation to investigate the drop performance of electronic package because it is fast and cost-effective. However, the solder balls, which are recognized as vital parts for the integrity of solder joints and the overall function...
This paper presents a structural health monitoring system for monitoring, with reduced visual impact, one historical building structure. The system is based on fiber Bragg gratings and comprises 19 displacement sensors and 5 temperature sensors. All the sensors were custom made according to the monitoring points' characteristics. The results obtained over the first year of monitoring are presented...
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