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This paper discusses the development of a chip scale level package substrate using liquid crystal polymer (LCP) laminates to support wideband millimeter-wave transmission lines and layer-to-layer transitions. To evaluate the reproducibility of RF performance on LCP in large-panel processing, an iterative design, simulation, fabrication, and test cycle is implemented. Inspection and verification methods...
This paper presents a novel MEMS-based reconfigurable multi-band power amplifier (PA) that employs a newly proposed reconfigurable biasing network and partitioned LTCC substrates. The biasing network comprises transmission lines, capacitors, and switches. Because DC bias current does not flow through switches, the proposed network functions as a multi-band low-loss biasing network. The partitioned...
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