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A novel test structure based on a planar capacitor design has been used for advanced barrier material evaluation and process optimization. This structure enables intrinsic reliability study of Cu/low-k interconnects. Various barrier materials such as CuMn self-forming barrier, ALD Ru, and PVD TaNTa on different dielectric films have been investigated to understand their intrinsic limits of barrier...
?? Scaling ?? Geometrical scaling is aided by the introduction of new materials ?? Classical reliability issues are magnified by different components of variability ?? Si Devices ?? Fully depleted device extend scalability ?? BOX charges in ETSOI devices could be a fundamental show-stopper ?? Non planar Devices ?? Dielectrics on non planar surface might be exposure (already in narrow width planar...
In order to solve the pixel divergence problem brought by print and scan process, propose the algorithm that applying stretching contrast grade to adjust image pixel divergence. The parameter setting of this adjusting method uses peak signal noise ratio as standard of measurement, even though using different printer and scanner, we can also get good adjusting image. Simulation results show that the...
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