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Self-aligned flip-chip assembly with sub-micron accuracy is of particular importance to low-cost manufacturing of single-mode opto-electronic components. The concept of alignment via surface tension force of melted solder has been proposed over two decades ago and appears simple. Yet, its effective working into manufacturing requires solving a few fundamental issues. In prior work, we introduced the...
Metasurfaces are artificial electromagnetic boundaries usually implemented as two-dimensional periodic arrays of engineered inclusions with sub-wavelength periodicity, which may serve as useful tools to control characteristics of electromagnetic fields. Recently the authors have proposed employing a class of frequency selective metasurfaces with self-complimentary patterns to construct optically thin...
A small antenna MACKEY (Metamaterial Antenna Chip developed by KIT EOE LaboratorY) consists of substrates that are metal plate loaded capacitance grids using AMC (Artificial Magnetic Conductor) substrate and dipole antenna is showing a characteristic distribution from the principle of operation, it is possible to be installed on a metal plate without affecting the characteristics of impedance and...
Cutting of packaged IC involves removal of different materials including semiconductor, metal and polymeric compound. Dicing saw has long been utilized to perform the task in regular (rectangular) shape. However, chipping and micro cracking at the edges and deteriorated strength of the packaged die are still problems to be solved. Laser has the advantages of being capable of cutting irregular shape...
Wearable products or biosensors require conformability to a complex curved surface or stretching and moving shapes such as parts of the human body. However, it is difficult to apply conventional printed wiring boards (PWBs) or flexible printed circuits (FPCs) to these applications. This situation prompted us to develop a novel wiring structure suitable for 3D-conformable devices. Our structure is...
Point defect in mono-layer graphene on Cu substrate shows significant change in electronic structure in comparison to without the presence of defect. Our attempt to observe the electronic structure of mono-layer graphene on Cu substrate shows the band-structure, binding energy and density of states. Well established density functional theory (DFT) calculation has been performed to study the stability...
A novel variable stiffness actuator composed of a dielectric elastomer actuator (DEA) and a low-melting-point-alloy (LMPA) embedded silicone substrate is demonstrated. The device which we call variable stiffness dielectric elastomer actuator (VSDEA) enables functional soft robots with a simplified structure, where the DEA generates a bending actuation and the LMPA provides controllable stiffness between...
For the better performance of piezoelectricity actuated ultrasonic nebulizer, some factors, which may have effect on the performance, are analyzed. A conclusion that the change of the cone angle in the vibration of the nebulizer does some contribution to the performance is got. According to this fact, a concept “moving cone angle” is put forward. The working principle of “moving cone angle” is introduced,...
The paper describes a process of mass assembly of thin chips with large number of I/Os onto silicon substrate using mechanical shape locking mechanism. A certain pattern was fabricated on the backside of 3mm × 3mm × 50µm ultrathin chips by conventional micro fabrication technique. A complementary pattern was also fabricated on 8″ carrier wafer which contains 324 receptor sites. Under the optimal agitation...
LD (Laser Diode) has different divergent angles in horizontal direction and direction, for example the divergent light angle is from 10[deg] to 35[deg] in horizontal direction and from 30[deg] to 40[deg] in vertical direction. To form the beam shape, an aspheric lens or an anamorphic lens has been used. But there are some problems in position alignment of lens or production cost. In this research,...
Despite the tackiness offered by ball attach fluxes, they have failed to prevent ball movement on solder on pad finishes when the solder protrudes above the solder mask. Solder bridging and joined balls become a common occurrence prompting heavy rework of units. Rework lengthens the manufacturing cycle time and poses a product reliability risk. The same ball movement plagues ENIG pads on FC ceramic...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important...
Plasma-exposed Si surface related to Si recess in source/drain region was investigated in detail for various superposed bias configurations with frequencies of 13.56 MHz and 400 kHz. Two different bias powers were utilized by an inductively coupled plasma reactor (ICP). The surface layer (SL) and the interfacial layer between the SL and Si substrate (IL) were analyzed by spectroscopic ellipsometry...
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