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This paper discusses challenges, design issues and possible solutions to get mm-Wave signals off-chip. Simulationand measurement results are discussed for three mm-Wave designs at different frequencies in bulk CMOS technology. (1) The design of a back-to-back IC-to-board interconnect using wire-bonding and microstrip lines is described to package and measure the chips without the need for a mm-Wave...
The leakage characteristics of the substrate integrated waveguide are presented. The numerical method based on the hybrid generalized scattering matrix (GSM) is successfully validated by using the published measured data of the SIW designs in Ku- and Ka-bands. The new structural parameters of the SIW, including the thickness of the periodical metal wall, and the width of the extended parallel metallic...
This paper discusses the design of a 60 GHz low noise amplifier (LNA) using a standard low power SOI CMOS process from ST Microelectronics. First, we outline the technology as well as the mm-wave design challenges. Using recent work on coplanar waveguide (CPW) modeling, we describe how it's possible to use parametric, 3D electromagnetic simulation to complete or replace analytical models of on-chip...
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