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Because of its good physical properties (high ac dielectric strength and high thermal conductivity), the polycrystalline Al2O3 is used in IGBT power modules packaging as interface between the electronics device and the cooling system. The various constraints (electrical, thermal and mechanical) undergone by the Al2O3 substrates in service can lead to charge development in surface (surface discharges)...
We present the use of swept wavelength interferometry for distributed fiber-optic temperature measurements in a nuclear reactor. The sensors consisted of 2-m segments of commercially available, single mode optical fibers. The interrogation technique is based on measuring the spectral shift of the intrinsic Rayleigh backscatter signal along the optical fiber and converting the spectral shift to temperature.
Cooling is important to keep the temperatures of the highly integrated silicon electronic devices and power devices e.g. power MOSFET, IGBT. Yamaguchi et al. have proposed a new scheme to cool down the devices by its own current named ldquoself-cooling devicerdquo, in which the cooling process uses Peltier effect. In the proposed scheme, we should use the materials that have high thermal conductivity,...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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