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This paper presents the analysis of temperature rise on PCB. Numerical solutions using Galerkin approach that is one of Finite Element Method (FEM) was used to study and analyze the temperature rise on PCB. Then, an algorithm has been developed using MATLAB. The PCB with four different width of copper is supplied with different range of direct current (DC) from 0.5 to 5 Amperes to capture the data...
In this paper, an advanced electro-thermo coupling model is developed to investigate the electromigration and electrothermo-mechanical effects on electronic packaging, especially on Package-on-Package (POP). POP packaging involves in ultra thin gold wire (phi = 1mil) on wirebonding and Sn4.0Ag0.6Cu (SAC405) solder ball on package. The current density arising in the aluminum pad (wirebonding) and in...
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