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Investigations deals with optimization of operating regimes of LEDs in lighting equipment for obtaining two purposes - maximum light output in dependence of ambient conditions and long term lumen maintenance. Thermal management calculations and heat sink choice are experimentally tested at various ambient conditions (air temperatures from 20oC to 55oC) and different current values through LEDs - up...
Thermal management is a key issue in LED packaging. To keep the LED junction temperature as low as possible, one has to address the spreading effect from a localised heat source into a bigger substrate as it is the case in the Chip On Board configuration (COB). We performed a benchmark of the existing analytical models for the spreading effect and derived a new model that allows a better prediction...
Investigation deals with LED's thermal management optimization in dependence of operating condition aided by application of infrared thermography. Thermal management calculations allow estimating temperature distribution on the LEDs, metal - core printed circuit boards (MCPCB) and heat sink but often real results may be different and experimental investigations are necessary. Good results are obtained...
The poor thermal design of high brightness light-emitting diodes (HB-LEDs) package for the automotive exterior lighting system causes the degradation of the optical and reliability performance, also the deterioration of the cost-effectiveness. We design the flexible package substrate with the thick heat-spreading layer and thermal via-hole fully filled with the copper (FFC) for the conventional process...
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