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Flip chip technology is one of the advanced chip packaging techniques in IC packaging industry. This technology may provide a solution to enhancing heat-dissipation and optical performance of the LED when applying to the LED packaging. The goal of this study is to experimentally and numerically study the thermal performance of flip-chip (FC) LED (with the size of 1 × 1 mm) with and without underfills,...
The junction temperature of a light-emitting diode (LED) directly and greatly affects its performances. Therefore, the reliable measurement and accurate estimation of the junction temperature of an LED is extremely important. This paper proposes an approach for directly determining the dependence of junction temperature on injected currents in InGaN and AlGaInP LEDs. Various important physical parameters...
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