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This letter presents a novel design for a silicon-based light emitting diodes (LEDs) packaging module with an integrated photosensor. The carrier substrate for the LED submount and a photosensitive element are directly fabricated on a silicon wafer, using ion doping and inductively coupled plasma etching, thereby achieving a smart LED packaging module featuring miniaturization, integration and low...
A low-cost high-resolution wavelength-division-multiplexing (WDM) interrogation system operating around 800 nm region with operational bandwidth up to 60 nm and resolution of 12.7 pm utilizing a tilted fiber Bragg grating (TFBG) and a CCD-array detector has been implemented. The system has been evaluated for interrogating fiber Bragg grating based strain, temperature sensors, giving sensitivities...
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