The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The next-generation implantable high-power prosthetic devices, such as retinal prostheses, will be powered by inductively coupled coils of high efficiency. However, the use of high-frequency power carriers almost always induces significant AC resistance due to skin and proximity effects, which limits the overall coupling efficiency. Inspired by the widely used round Litz wire, planar coils with planar...
This paper reports gamma irradiation effects on the resistance of polycrystalline silicon beams in MEMS. Co60 irradiation test was performed to reveal mechanisms underlying radiation effects. Changes of the resistances have been measured by Semiconductor Characterization Instruments. The mechanisms of gamma irradiation effects on the resistance of polycrystalline silicon were discussed in detail....
This paper describes the design of a micromachined nanopositioner with electrothermal actuation and sensing capabilities in a single silicon chip. The positioner has a dynamic range of 14.4 μm with a differential sensing scheme. At 6-V dc bias voltage, the position sensors have a power consumption of 120 mW, and a sensitivity of 0.27 mV/nm. The open-loop bandwidth is 101 Hz and the phase...
MEMS electron-transparent membranes made of low-stress silicon nitride are widely employed in electron microscopy. However, this material has limited resistance to electron beams. We therefore developed a layer of LPCVD SiC. Our layer is amorphous, uniform, continuous, low-stress, and has extremely low etch-rates in common wet etchants. As free-standing electron transparent window, it demonstrates...
This paper reports the design, fabrication, and testing of a multilayer cantilever structure having a doped silicon heater-thermometer separated from the silicon cantilever legs by a thermally insulating silicon nitride layer. The multilayer microcantilever can be heated above 600??C. Highly sensitive thermal topography measurements were successfully demonstrated on a 20 nm tall silicon grating. The...
This paper presents the design and optimisation of high quality (Q) factor inductors using Micro/Nano Electro-Mechanical Systems (NEMS/MEMS) technology for 10 GHz to 20 GHz frequency band. Three inductors have been designed with rectangular, circular and symmetric topologies. Comparison has been made amongst the three to determine the best Q-factor. Inductors are designed on Silicon-on-Sapphire (SOS)...
In this work we present an experimental study of the electromechanical behavior of suspended, taut, single walled carbon nanotubes (SWCNTs). A novel top-down fabrication process was developed in order to integrate the suspended SWCNTs into silicon MEMS structures fabricated using conventional micro-machining techniques. The resonant response of suspended SWCNTs under a time-varying electric field...
This paper introduces a class of single crystal silicon micro-scale differential scanning calorimeters for rapid detection and thermal characterization of energetic materials. The suspended membrane micro hotplates have fast time response and high sensitivity, which enables thermal measurements of melting endotherms and deflagration exotherms in energetic materials such as RDX and TNT. The potential...
This paper reports the design, simulation and fabrication of a MEMS fluidic inertial sensor, which integrates three-axis gyroscope and dual-axis accelerometer so that the device can independently detect three components of angular rate and two components of linear acceleration. The gyroscope utilizes jet flow directly created from an integrated micro pump. This simplifies packaging process while maintaining...
This paper proposes a direct metal patterning method on three-dimensional structures with vertical side walls. It uses a 3-D multi-height silicon shadow mask made by double-side Deep Reactive Ion Etching (DRIE). Aluminum has been successfully patterned on the top, bottom and vertical side walls of 280mum wide trench with a depth of 250mum by sequentially tilting the wafer at three different angles...
We describe multiple embedded polysilicon resistive sensors in CMOS-MEMS electrothermal probes as a step toward creating probe arrays for passing current on ICs to reconfigure resistance change (RC) vias. When not in contact, a low-resistivity unsilicided polysilicon (LP) resistor detects probe displacement indirectly through the temperature coefficient of resistance (TCR) effect. When in contact...
A novel packaging approach has been demonstrated for circuits connected with flexible microsprings. The approach is based on silicon micromachined features and results in a highly accurate and low cost packaging solution. The micromachined features were processed into silicon with an anisotropic wet etch forming inverted pyramidal micro-pits. The pits are integrated into the chips along with arrays...
Monolithic integration of DC-DC converters with on-chip inductors has emerged as a viable means to reduce size and increase transient performance for portable electronics applications. High-power-density inductors have been recognized as a barrier for such integration. In this paper, a CMOS-compatible process that is capable of fabricating on-chip inductors with low DC resistance and high power density...
A surface-micromachined compact microheater for gas sensing applications fabricated on a silicon substrate is presented. The heater was fabricated with a compatible CMOS process and its membrane was released using XeF2 isotropic silicon etching. The membrane had SiO2/SixNy/SiO2 layers (0.4/0.3/0.3 mum) in order to restrict the initial stress after the release, resulting in less than 2.5 mum height...
The purpose of this paper is to apply characteristics of residual stress that causes cantilever beams to bend for manufacturing a micro-structured gas flow sensor. This study uses a silicon wafer deposited silicon nitride layers, reassembled the gas flow sensor with four cantilever beams that perpendicular to each other and manufactured piezoresistive structure on each micro-cantilever by MEMS technologies,...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.