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With deeply scaled CMOS technology, Bias Temperature Instability (BTI) has become one of the most critical degradation mechanisms impacting the device reliability. In this paper, we present the BTI evaluation of a single inverter gate covering both the PMOS and NMOS degradations in a workload dependent, atomistic trap-based, stochastic BTI model. The gate propagation delay depends on the gate intrinsic...
This paper presents a novel failure prediction technique that is applicable for system-on-chips (SoCs). Highly reliable systems such as automobiles, aircrafts, or medical equipments would not allow any interruptive erroneous responses during system operations, which might result in catastrophes. Therefore, we propose a failure prediction technique that can be applied during an idle time when a system...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
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