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Polycrystalline thin films often have residual stress that is affected by the growth conditions (temperature, deposition rate, etc.) and material parameters. Real-time wafer curvature measurements from many groups have enabled the stress evolution with thickness and its dependence on processing conditions to be quantitatively determined for a large number of systems. Based on these results, we have...
Residual stress is a longstanding problem in thin film growth that affects film performance and limits the range of applicability. A better understanding of why this stress develops and how it depends on the growth conditions and material properties would improve our ability to predict it and control it. We describe a kinetic model we have developed that explains stress evolution in terms of a dynamic...
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