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Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
Emission spectroscopy of plasma-excited chemical species is widely used for generalized chemical analyses in bench-top systems. This paper explores the use of pulsed microdischarges between two and three electrode microstructures, which operate in air at atmospheric pressure, for use in handheld chemical analyzers. Pulsed microdischarges are fired between two-electrodes spaced apart by 0.2-2 mm. Synchronized...
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