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This paper presents the usage of a nanorobotic handling technique for the transfer of individual coppernanowires with diameters between 150nm and 400nm and length of about 10 µm. Handling and assembly are inside the SEM and use electron beam induced deposition as well as focused ion beam milling. The handled nanowires are used to assembly a NEMS device, namely an electrostatic switch design, where...
In this paper the usage of a nanorobotic handling technique is presented for the transfer of individual nanowires with diameters of several 100 nanometers and length of about 10 µm. Both, handling and assembly take place inside a SEM and use electron beam induced deposition (EBiD) as well as focused ion beam (FIB) milling. The handled nanowires are used to assembly a NEMS device, namely an electrostatic...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
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