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This paper proposes to provide testability for the breaking point produced by the Through-Silicon-Vias (TSVs) of 3D-Stacked ICs (3D-SICs) during pre-bond testing with low Design-for-Testability (DfT) cost. Different from prior solutions which utilize two additional wrapper cells for the breaking point at each TSV, this paper proposes to provide the testability of two ends of the TSVs respectively...
We present a practical, systematical method for the evaluation of the soft error rate (SER) of microelectronic devices. Existing methodologies, practices and tools are integrated in a common approach while highlighting the need for specific data or tools. The showcased method is particularly adapted for evaluating the SER of very complex microelectronic devices by engineers confronted to increasingly...
Polymorphic gates can be considered as a new reconfigurable technology capable of integrating logic functions with sensing in a single compact structure. Polymorphic gates whose logic function can be controlled by the level of the power supply voltage (Vdd) represent a special class of polymorphic gates. A new polymorphic NAND/NOR gate controlled by Vdd is presented. This gate was fabricated and utilized...
For several decades, the output from semiconductor manufacturers has been high volume products with process optimisation being continued throughout the lifetime of the product to ensure a satisfactory yield. However, product lifetimes are continually shrinking to keep pace with market demands. Furthermore there is an increase in dasiafoundrypsila business where product volumes are low; consequently...
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