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Double gate devices, especially FinFETs have emerged as a superior alternative to conventional bulk MOSFETs to continue scaling down to sub 32 nm regime. According to the specified scaling length, a FinFET structure is superior in controlling short-channel effects (SCEs). Independent control of front and back gate in double gate (DG) devices reduces the effective switching capacitance and, hence,...
This paper presents a method of suppressing kink effects which originate in the corners of triple-gate bulk FinFETs. We propose corner implantation to turn off the parasitic corner device which has lower threshold voltage than the bulk device. This method is investigated in triple-gate bulk FinFETs by 3D numerical simulations. Threshold voltage shift of 0.434 V with a decrease in on-state current...
In this paper, the effect of channel implantation dose and energy has been studied for the design of nanoscale FinFET devices for high frequency application. It was observed that the threshold voltage of the device may be increased through both implantation dose and energy but the later is preferable because of less carrier scattering. The drain current and the peak cut-off frequency of the device...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
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