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The transformation of the intermetallic compounds (IMC) at the interface of Sn-Zn solder and Cu substrate by an ultrasonic-assisted soldering method with the variation of Zn content was investigated. The formation of IMC at the solder/Cu interface is controlled by the Zn content in the filler metals. The IMC layer of Cu6Sn5 forms if the mass fraction of Zn is lower than 0.5wt.%. The IMC becomes a...
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