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Solder joints are subjected to a complex combined loading condition of tensile and shear deformation. The fracture behavior of solder joints is different when it is subjected to pure-tensile, pure shear or varying combination of mixed-mode tension and shear loading combinations. The observed failure modes can vary from brittle intermetallic (IMC) layer failure to ductile bulk solder shear failure...
The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intermetallic compound, fine needle-like AuSn4 was found at the solder/pad interface under as-bonded condition. After...
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