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Summary form only given. This work investigates the reflow behavior of lead-free Sn-3.8Ag-0.7Cu solder on Cu substrate in the presence of Mo nanoparticles up to 0.1 wt%. Solders were reflowed in a reflow oven up to six times. The melting behavior of the composite solder was investigated by differential scanning calorimeter. The spreading rate and wetting angle were evaluated to measure the solderability...
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and differential scanning calorimetry (DSC) respectively. Overall results indicates that Sn3.8AgO.7Cu having the most favorable results with...
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