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Summary form only given. Accompanying of MEMS sensor using in consumer production widely, system in package (SiP) technology becomes popular to integrate CMOS device (such as ASIC or DSP) with MEMS sensor together. It is excellent to connect sensor to signal amplifier directly to deduce RC delay and board level noise. However, with CMOS technology evolution to 0.13um or 90nm, the thermal stability...
This paper presents global dynamic power and signal integrity analysis methodologies for chip-package-board co-design and co-simulation. The proposed methodologies are based on efficient combination of power switching activity macro-modeling with broadband multi-port model extractions. Dedicated real-life test carriers are employed for benchmarking purposes and correlation with on-wafer measurement...
This paper discusses electromagnetic (EM) and thermal co-analysis for chip, package and board co-design and co-simulation. The limitation of classical divide-and-conquer approaches based on cascading techniques are investigated in reference to global methodologies where chip, package and board are simulated using one single model methodology. Cascade and single model methodologies are applied to a...
The system-in-package (SiP) is one of the popular designs to meet the trend of integrated circuit (IC) development. It is known for its small size, light weight, and multiple functionality. In this paper, a radio frequency front end module (RF-FEM) incorporated with the novel wafer-level chip scale package (WLCSP) technology is investigated. Generally the solder joints in WLCSP are the weakest portions...
This paper presents a global IC-package-board co- simulation methodology for SiP (system-in-package) applications. The proposed methodology, using internal ports (auxiliary sources) concept, is applied to a real-word NXP- Semiconductor SiP test carrier built in Cadence SiP and optimal SiP-tooling environments. The obtained global simulation results, for identified complete multi-level IC-package-board...
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