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This work investigates the possibility to reduce the thermal stressing of high power IGBT modules in a DC-current application. Using four load current profiles as examples, two mitigation strategies are presented and their benefit to the power stack in terms of lifetime prolongation is evaluated. In the final part of the work, the investigation focuses on the relation between the shape of the load...
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) modules are installed in traction drive applications and large industrial motor drive applications, so they require high power density and reliability. Enhancing power density of power modules increases thermal stress and especially reduces power cycle lifetime. This paper describes the design approach for reducing thermal stress by reducing...
The aim of this work is to investigate the impact of the heat sink thickness and material, as well as, of the convection coefficient of the water cooling system on the power-electronics module thermal stressing. The heat extraction capability of different thicknesses is tested. It is concluded that the thickest heat sink results in marginally lower temperature variation at the junction level compared...
This paper presents a design and experimental validation of a temperature feedback control scheme to realize the reduction of temperature variation amplitude of power devices or modules. A full-order observer state-space thermal model enables estimation and control of the temperature at reliability critical locations only measuring one accessible location.
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