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In standard power cycling tests, forward conduction generates heat in the die and therefore the ther-momechanical stress in the package. In application, however, a significant part of the power losses are switching losses, so that the load current is lower than in standard power cycling test, for an equal temperature swing. A new concept for power cycling tests is presented, which allows the generation...
Temperature estimation is of great importance for performance and reliability of IGBT power modules in converter operation as well as in active power cycling tests. It is common to be estimated through Thermo-Sensitive Electrical Parameters such as the forward voltage drop (Vce) of the chip. This experimental work evaluates the validity and accuracy of two Vce based methods applied on high power IGBT...
A power cycling test bench is realized for the lifetime analysis of IGBT power modules and for the development of a reliability management system predicting the deterioration of the devices. The focus is on converters for doubly-fed induction generators used in wind turbines. In these applications, due to the low frequent power losses under steady state conditions and due to changing wind conditions,...
We present the design of a cycle test system for automated stress testing of smart power switches under automotive load short circuit conditions up to 250A / 50V. A fast overcurrent detection and shutdown strategy protects the test equipment from damage. Device degradation and failure data are recorded individually for statistical analysis of time-to-failure distributions. Representative measurements...
This paper investigates on refining lifetime models of power semiconductors. Especially the lifetime of heavy wire bonds is a weak spot and needs to be modeled in more detail. For a thorough understanding of the processes leading to a failed bond it is necessary to investigate more influencing factors than just the temperature excursion. Power cycling results for 125 ??m wire revealed a much higher...
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