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This paper designs a vertical-interconnect transmission structure which could be applied in PoP(Package on Package) package structure. In this model, Through Mold Via(TMV) transmission structure is utilized to realize inter-side and stacked-model interconnection. A quasi-coaxial via cluster connected to the strip line is designed for vertical RF transmission. It was found that the center distance...
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit (IC) devices, resulting in the need for more advanced and sophisticated packaging techniques. In particular, the integration of the application processor...
Expanding FOWLP (Fan-Out Wafer-Level Packaging) from mainly 2D single or multi die solutions to 3D stacked multi-die solutions with SMDs integration, is of crucial importance to meet the requirements arising from new markets such as IoT/IoE and Wearables. This drives the development of new capabilities and technology breakthroughs in the current FOWLP process. One of the most hailed capabilities of...
The market of Connectivity, Internet of Things (IoT), Wearable and Smart industrial applications leads Fan Out Wafer Level Package (FOWLP) technologies to a promising solution to overcome the limitation of conventional wafer level package, flip chip package and wire bonding package in terms of the solution of low cost, high performance and smaller form factor packaging. Moreover, FOWLP technology...
Package-on-Package (PoP) has many advantages, small foot-print, better performance, easier to debug, and better control over supply chain, etc. Recently PoP integration architecture based on fan out wafer level package (FOWLP) and through mold connection (TMC), demonstrated and many back-end manufacturing houses completed the qualification and migration to this architecture. Despite the cost and performance...
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