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A novel HD-FO package platform was introduced with a hybrid RDL structure. An HD-FO package with hybrid RDL could enables higher routing density and multi die construction in a planner configuration. The 1-µm and submicron RDL wafers were fabricated at a foundry and then the essential parts of the inorganic RDL were integrated with Amkor's internal organic RDL process making a hybrid structure. Also,...
The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The...
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