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With the proliferation of area array packages in consumer, enterprise, automotive, medical, and military electronics, a wide range of board level underfills and edgebond adhesives, reworkable and non-reworkable, have been developed to ruggedize these components. While these materials are used to enhance drop test, bend test, vibration test and Tumbling test performance, their use can affect thermal...
3D Memory package-on-package stacking has gained popularity due to increase in demand for bandwidth, higher density and miniaturization. Challenges in design of high performance 3D stacks have increased with amplification in speed and signal integrity issues. This paper dissects the design elements of 3D memory stacks architecture and characterizes the signal integrity and trade off of wirebond and...
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