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This letter1 presents a method to measure the Young's moduli of individual thin-film layers in a commercial integrated circuit (IC) foundry process. The method is based on measuring the resonance frequency of an array of micromachined cantilevers and using the presented optimization analysis to determine the elastic modulus of each layer. Arrays of cantilever test structures were fabricated in a commercial...
Summary form only given. It has been long believed that residual stress is the root cause of tin whisker formation on pure tin-plated component leads. However, tin whiskering also happens to a lesser degree on other tin-based alloys under certain conditions. In this study, the tin whisker phenomena were reported on Sn-Pb HASL coating layer inside plated through holes with press-fit complaint pins...
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