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The applicability of Microwave Induced Plasma (MIP) afterglow etching in copper wire bonded IC package decapsulation is investigated. In-situ monitoring of the processing temperature during plasma etching is conducted with SOT23 components with diode devices inside as temperature sensor. Parameters that influence etching temperature and efficient MIP etching process are discussed. Aged epoxies in...
This paper describes the design and fabrication of liquid metal interconnects (vias) for 2.5D and 3D integration. The liquid metal is gallium indium eutectic (78.6% Ga, 21.4% In) with a melting temperature of approximately 15.7 °C, which is introduced into via openings of a silicon interposer. This liquid metal interconnect technology can be integrated with existing interposer technologies, including...
The need for low cost gas sensors has been required especially for home usage. Possible applications are, in buildings or basements where possible toxic gases can be accumulated, for example carbon monoxide, carbon dioxide, methane. This paper presents a first step in developing gas sensors based on impedance measurements. For optimal sensor operation a heater that should ensure uniform heating of...
In this research project we provide one quick design method for a high current density power distribution board design and improvement on a high end server system. It is based on system power source to sink the current path for design PCB (Printed Circuit Board) copper shape dimension and thickness, and add some power or ground via for stitching each power or ground plane on a multi-layer PCB design...
The Swedish nuclear waste will be stored in copper canisters and kept isolated deep under ground for more than 100,000 years. To ensure reliable sealing of the canisters, friction stir welding is used. To repetitively produce high quality welds, it is vital to use automatic control of the process. This paper introduces a nonlinear model predictive controller for regulating both plunge depth and stir...
This work presents a thermoelectric energy generator (TEG) device with a card structure which embeds a thin-film based TEG chip. The thermocouples are densely arranged between comb-shaped substrates in the chip. The chip is packaged vertically and heated/cooled by metallic plugs connected with the external heat source and heat sink. The packaged device has a footprint of 3 mm × 1.2 mm, while the height...
The aim of present work was to study the influence of SiO2/Al2O3 molar ratio (MR) on nickel behavior in the mordenites with wide variation of MR during reduction in hydrogen flow. It was found that during reduction treatment variation of MR in mordenite from 10 to 206 influences reducibility and mobility of reduced nickel species. Stability of the reduced samples during storage in air at ambient conditions...
Thin films of Cuprous Oxide (Cu2O) with different deposition temperatures have been deposited on glass substrates by spray pyrolysis. The films were investigated in terms of morphological surface, structural and electrical properties exhibited p-type conduction.
This paper emphasizes the factors to be considered when designing power connectors used in the load and temperature tests of power transformers. External conductors used to perform load and temperature tests in transformers are referred as power connectors in this contribution. Electrical and thermal investigations of a single-phase shell-type, 300 MVA, 400 kV–21.5 kV power transformer connector were...
The reliability assessment of tungsten via to copper interconnect were investigated. Just-landing and un-landing via structure showed similar EM characteristics to full-landing structure. The activation energy of EM is about 0.86 and current density exponent is about 1.9, which means the mechanisms of interfacial diffusivity and line depletion stress. The resistance shifting of all splits was no more...
Vertically aligned carbon nanotube (CNT) arrays can provide the required combination of high thermal conductivity and mechanical compliance for thermal interface applications. Much work in the last 15 years has focused on improving the quality and intrinsic thermal conductivity of the nanotube arrays. Currently the thermal interface resistance between nanotube arrays and surrounding materials limits...
A new heat transfer method, which combines the merits of liquid jet impingement heat transfer with metallic porous surfaces, is proposed. The porous surface was made by sintering a single layer or multiple layers of copper wire mesh screen to a plain copper base heat transfer surface. Experiments were conducted with a 2.0-mm diameter circular water jet impinging onto a 6.35-mm diameter circular porous...
High power packages require a low junction-to-case thermal resistance (Theta jc) to achieve target junction temperatures. Theta jc is a metric used to compare package-to-package relative thermal performance. It is also used in two-resistor models to predict thermal performance under system level conditions. This study shows that the commonly used Theta jc definition does not correctly track package...
Plate-fin heat sinks have been a successful technology in electronics cooling. Thermal performance of such heat sinks, however, has been driven to improve due to increasing heat generation in modern electronics devices. This paper proposes to introduce short pin fins on surfaces of plate-fin heat sinks to address such challenges. A microfabrication approach based on photolithography and electroplating...
Herein we describe the annealing behavior of copper Through Silicon Vias (TSVs) in a series of experiments. Temperatures ranged from 150 °C to 450 °C and the dwell of the temperature varied between 30 min and 4 h. Copper protrusion, test samples warpage and the copper microstructure were examined in a subsequent characterization. Combining the results of these measurements enables the determination...
In this paper we describe measurements of electromigration failure times in the metal traces of silicon Integrated Passive Devices (IPDs) and in the redistribution layers of embedded Wafer-Level BGA (eWLB) structures, for both aluminum and copper traces, and for via connections between the two metal layers. The results of the test are used to determine the coefficients of Black's Equation, which is...
Fireproof professional garments must protect to the extent possible firefighters from damages, either direct (caused by fire) or indirect (caused by excessive heat). In some cases, risks are not associated to an immediate cause, but to a long exposure to heat sources causing excessive thermal stress to the human body. Firefight equipment currently available does not include any means to detect thermal...
The escalating heat dissipation problem in electronic devices has become the key driver to numerous investigations on new cooling techniques, including the heavily-researched microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geometries, which is believed largely due to the fabrication and operational challenges. In present study,...
The conducting properties of core/shell nanoclusters of two different materials - one with a metal core/ semiconductor shell, and the other with a metal core/ insulator shell have been investigated. Experiments carried out for the two samples under the same conditions demonstrate distinct variations in the conducting properties of both. At increasing temperatures, the metal/semiconductor core/shell...
Temperature, flow and pressure are critical parameters that influence the performance of fuel cells, in terms of potential, current and power density, for example. Hence, the monitoring of non-uniform temperature/flow rate/pressure within a proton exchange membrane fuel cell (PEMFC) is crucial. To prevent degradation of the performance of a PEMFC, the size of sensors is reduced herein to a µm scale...
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