The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Fuses and Circuit Breakers play an important safety role in electrical transportation systems. Challenging new applications, especially in DC grids, have brought conventional current limiting devices to their limits. Indeed, mechanical circuit breakers may be too slow to open for networks with large DC fault currents. On the other hand, fuses may be too slow to open with very low DC fault currents...
This paper presents the design, manufacture and characterization of connector-less 1200 V SiC MOSFET half-bridge power modules based on AlN DCB substrate. The modules contain four MOSFETs and no external antiparallel diodes. They are rated for a current of 40 A and include a shunt. Static and dynamic measurement results are presented. Multiphysics simulations are used to validate the measured data...
Copper and aluminum, different in electric and mechanical properties, are the main marterial of the internal winding of the transformer, there, nevertheless, is a loss of effective method to identify them unless destroying the insulation. To solve the problem, a test platform is established with an effective and nondestructive method based on Seedback effect is provided in this paper to mesure the...
Copper pillar bump interconnect technology, with its good electrical properties and electromigration resistance, is becoming the next key technology for fine pitch interconnection of chips. The study of the effect of copper pillar bump size on the interfacial diffusion reaction has directive significance to the application of copper pillar bump. This paper focuses on the effect of size on the reliability...
This paper will discuss the technological aspects of direct bonding copper (DBC) process conducted on a copper foil (M006) with high thermal conductive alumina (BK-96, BK-100) and aluminum nitride ceramics (AIN) being utilized in bonding. There is a wide use of DBC structure in the construction of high power semiconductor devices. The paper will also provide the results of the research on compound...
A method for measuring leakage current in LDPE insulated miniature cables containing volatile additives is presented. It is shown that with the presented method the volatiles are sufficiently contained in the test object even at temperatures up to 90 °C. This is achieved through non permeable encapsulation around the outer insulation screen (extruded semiconducting layer). Guard electrodes are adopted...
The thermal behavior of an industrial Low Voltage non-segregated three-phase busduct is analyzed by means of the comparison of a 3D numerical model with experimental results. This model has been carried out using COMSOL Multiphysics, software based on finite element method. The numerical model replicates the short-circuit test, using the same geometry configuration and the boundary conditions of the...
We explored the properties and performance of copper-based metallic nanoparticle paste (MNPs) for interconnects applications in 3D heterogeneous integration. A patterning method was developed to process micron sized sintered MNPs structures. This enables the fabrication of IC interconnect test structures to characterise specific resistivity sintered MNPs and the contact resistances of sintered MNP...
Reduction of development time of an advanced Electronic Control Unit (ECU) requires optimization of the product design at the early stage of development. A simulation-driven design has been used effectively to define the ideal position of components for optimum reliability even before the first prototype is manufactured. Such methods are based on a virtual design of experiments that allows to investigate...
This paper presents the design of a regulator to control the temperature of a semi-infinite diffusive interface medium by using a unique robust controller for three different materials: aluminum, copper and iron. The second generation CRONE is used to control the temperature at the boundary where the density of flux is applied (i.e., x=0mm) as the parametric uncertainties (due to the copper and the...
Thermo-mechanical stresses are often induced during processing of IC-packages. This is mainly due the Coefficient of Thermal Expansion (CTE) mismatch between the materials used to make these packages. Therefore, accurate CTE measurements is of great importance. In this study in-plane CTE measurements were conducted for thin film samples using Digital Image Correlation (DIC). The methodology was validated...
Theoretical analyses on the thermo-mechanical behavior of power modules designed in a new buildup and interconnection technology based on silver sintering and electroplated copper interconnects have been made. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects and the high voltage applicability of the resulting modules...
We have developed a new, highly effective method of sintering copper wiring printed in copper nanoparticle inks. Here extremely low oxygen partial pressure necessary for copper oxide reduction is provided by an oxygen pump and atmospheric pressure plasma is used to facilitate grain growth. We have achieved grain growth from 15 nm to about 300 nm at 180 degrees Celsius. The resultant metal is void...
Latest Computational Fluid Dynamic tools allow modelling more finely the conjugate thermo-fluidic behaviour of a single electronic component mounted on a Printed Wiring Board. A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. So it is possible to confront the predictions of the fully detailed numerical model of...
We report the use of Insulator-Metal Transition (IMT) of vanadium dioxide (VO2) to modulate Fabry-Pérot resonances in a terahertz Fabry-Pérot resonator. Our two-plate Fabry-Pérot modulator consists of one partially reflecting plate of monolayer graphene on a polymer substrate, and another plate of VO2-integrated copper electrodes. VO2, a strongly correlated electron system, undergoes IMT upon application...
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-004 corrosion tests: copper mirror, copper panel corrosion test, Surface Insulation Resistance (SIR) and Elecrochemical Migration (ECM). Other SIR and ECM tests are described in Bellcore GR-78-CORE and JIS Z3197...
In this paper, wet cleaning solution compatible with cobalt are investigated to achieve low Co etching rate on blankets film and no film attack on patterned 14nm wafer after line and via etching. Proposed solutions are compared to conventional wet cleaning solutions [5],[6].
The reliability of bolted joints is a concern for high-powered devices as the generated heat and thermal expansion could loosen the connections over many actuation cycles. There currently appears to be relatively little information on what material combinations, surface finish, etc. would be beneficial. This work experimentally evaluates the reliability of bolted contacts over 100 cycles and develops...
The dynamic suction process of pneumatic ejector is studied when the pressure inside the vacuum tank decreases from atmospheric pressure to extreme vacuum degree. The temperature change is one of the important parameters in the dynamic suction process of pneumatic ejector. In this study, the temperature change is analyzed by experimental approaches. The temperature is measured by the stop method....
This study introduces indirect water cooling systems and their improvements utilized in proto typing of vehicle machines. Due the vehicle machines require high torque at acceleration they are often equipped with indirect liquid cooling. One common method to implement liquid cooling is a water jacket inside machine frame as well as on the end plates. The flow rate of different cooling systems are studied...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.