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This study represents the results of Cu/In bonding based on solid-liquid interdiffusion (SLID) principle for 3D integration. Fine-pitch interconnects were successfully fabricated at the bonding temperature of 170 °C. The final microstructure of the interconnects consists of Cu and Cu/In intermetallic compounds (IMCs) and it is described in detail. The influence of the isothermal storage on the microstructure...
Sleeping is a vital biological requirement in the homeostatic mechanism. Sleep disorders can cause personal health problems and life quality deterioration. Transient waveforms (k-complexes, sleep spindles, arousal, etc.) happens instantaneously in sleep, have distinctive structural features, amplitudes and frequencies, and are difficult to distinguish from the background of electroencephalography...
Aiming at solving the problem of shrinkage in complex squeeze casting, Aluminum Alloy gearbox was taken as the research object, and the numerical simulation was done with the professional casting analysis software ProCAST. The characteristics of casting structure were analyzed, and the possible defects of casting solidification were predicted and analyzed. The results show that under the casting temperature...
A low temperature and low pressure fluxless bonding of plateless Cu-Cu substrates has been achieved by transient liquid phase sintering of Ag and Sn-Bi eutectic powder mixture in a formic acid reducing environment. The effects of Sn-Bi addition amount and sintering temperature to the shear strength and microstructure were investigated. Remelting temperature of the sintered paste was also examined...
There are established macroscale fabrication methods to create parts of virtually any shape or size; but for components in the microscale range (thousands to tens of microns) there is a dearth of options for making 3D parts at high enough throughput to make them practical. This paper demonstrated a novel method to create novel micromolding processes that are capable of creating defect-free microscale...
We have designed and microfabricated millimeter-scale wing-shaped hybrid microstructures composed of rigid structures of single crystal silicon (SCS) and flexible polyimide (PI) membranes. The wing-shaped microstructures mimicking insect flapping flight have been designed using a fluid-structure interaction analysis, and have been microfabricated using microfabrication technologies with the SCS substrates...
This paper presents a double-side-exposure scheme based on computer-numerical-controlled (CNC) UVLED lithography for fine 3-D microfabrication. The CNC UV-LED lithography manipulates the exposure angle of the UV light where the system comprises a switchable, movable UV-LED array as a light source, a motorized tilt-rotational sample holder, and a computer-control unit. The double-sided exposure scheme...
It is known that the coercivity in Nd-Fe-B magnets is correlated to the grain size as showed by Ramesh et al. [1], where he concluded that coercivity decreases as grain size increases, varying inversely as the logarithm of the square of the average grain size of the magnet.
Improving the output of current-perpendicular-to-plane giant magnetoresistance (CPP-GMR) sensor has been the central issue to meet the requirements for next generation read sensors.
Despite being one of the oldest and well-researched magnetic materials hexagonal ferrites are still of high interest for a number of applications and consequently for academic research.
This paper used an effective annealing process to improve the performance of Parylene C micropore-arrayed membranes fabricated with Parylene C moulding strategy. The results indicated that the annealing treatment at 320°C for 2h in nitrogen sealed the keyholes, which were unavoidably generated in the conventional Parylene C moulding process, because of melting and reflow at high temperature. A chromatic...
We present a new transparent high-performance triboelectric microgenerator (TEMG) based on an emerging material, silk fibroin. Silk fibroin has a strong ability to lose electrons and occupies a top-level positive position in the triboelectric series. It thus significantly contributes to the performance enhancement of TEMG. To efficiently harvest energy from airflow, a channel-shaped TEMG was developed...
Samarium-cobalt alloys opened the era of the rare-earth permanent magnets, in which the energy density of magnets increased by a factor of ten in the first few decades.
Metallic glasses (MGs) can be produced with a wide range of unique properties suiting them to a wide range of applications, from transformer cores to active elements inside sensors and other measurement devices.
Real time X-ray imaging videos of the entire soldering process for preform solders, solder pastes and BGA solders as well as solder alloy solidification and microstructure characterisation has been achieved over numerous experiments at the SPring-8 synchrotron. This paper overviews the developments of this challenging technique and provides key findings related to understanding the reliability of...
High radiation dose impedes the development of in-vivo micro-CT. In this paper, we presents a low dose and fast invivo micro computed tomography (micro-CT) system based on equally sloped tomography (EST) technique and the monochromatic synchrotron X-ray source. Comparing with regular CT, the projection number required for our imaging system can be reduced by about 75%. In addition, combining with...
There is ongoing research seeking solders with improved performance under harsh environmental conditions, elevated operation temperatures, and higher mechanical loads while, at the same time, meeting new emerging requirements for the continuous miniaturization of electronics. Bi has been identified as one of the advantageous alloying elements that significantly improve solder performance. The present...
Ag sintering technology based on Ag paste is becoming an attractive alternative to soldering for high-temperature and high-reliability power electronics packaging. The Ag paste exhibits a complex viscous flow, during which solvent have a great effect on the movement, arrangements and distribution of Ag particles. These factors inevitably influence the porosity, pore size, and distribution of the sintered...
Low temperature bonding of Au-electroplated Cu and Cu electrodes with Sn-57Bi-1Ag solder was examined. Longer bonding time gave a Au/Cu joint higher melting point. In the joint bonded at 170 °C for 1 min, a large scallop-shaped AuSn4 layer formed in the joint interface of Au and solder. A Au-diffused layer formed in the tip of the AuSn4 layer. The Sn-Cu-Au layer including approximately 20 mol% Au...
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