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With the most popular electronics products being the slimmest ones with the highest functionality, the ability to thin, stack and interconnect chips is becoming more important. One method to accomplish this is by using the through silicon via (TSV). This is a means of electrical connection in 3D stacked devices that saves space and shortens the electrical interconnect length, improving electrical...
This paper presents mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. The authors proposed an isothermal fatigue test method using real size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the agreement between the simulation model and experimental results. Based upon the Manson-Coffin's law...
As far as components with flip chip interconnects are concerned, one of the popular packaging solutions available in the market is thermally enhanced flip chip ball grid array (TEFCBGA) packages, which target mid to high performance applications. Traditional as it may be, the development of a reliable TEFCBGA package is still a very challenging task. The demands for high electrical performance with...
There has been a growing interest of parallel mechanisms which offer a high degree of precision, stiffness and dexterity to name just a few of their benefits as opposed to their traditional serial counterparts. For the applications of parallel mechanisms in the field of sensor, previous work was focused on investigating the 6 degree-of-freedom force/torque sensors based on common Gough-Stewart platform...
Window ball grid array (wBGA) package has become one of the most popular alternatives for DRAM packaging due to its high I/O density, high heat dissipation, low profile and high electrical performance. The reliability issue with excessive warpage of the wBGA packages, which results in solder joint failure during or after solder reflow process, or during thermal cycling, is needed to be resolved. To...
Most accelerated temperature cycling (ATC) tests reported the observations that SnAgCu (SAC) solders have better thermal fatigue reliability than SnPb solders due to their lower creep strain rate. But material studies revealed that this is true only when stress level is below a certain level. When the stress level in the solder increases, eventually the creep strain rate of SAC solder may outgrow...
The lifetime of an IGBT power electronics module under cyclic temperature loading conditions has been analyzed using finite element analysis method. The failure mechanisms that have been taken into account are the fatigue of the chip-mount-down solder joint, the substrate attach solder joint, the busbar solder joint and the Aluminum wirebond. The results show that the lifetime of the module is about...
Semiconductors are solids whose electrical conductivity is intermediate between that of a conductor and an insulator. Semiconductor devices are active devices that consume, accumulate, and discharge the supplied electric power. They are used as electronic or power devices. The former are employed in the control systems of electrical products such as mobile phones and computers, which are controlled...
In this paper, according to the condition B in the drop test standard of JEDEC, create 3D finite element model of VFBGA (very-thin-profile fine-pitch BGA) packages in drop and impact, the material model of solder joints can be indicated by Cowper-Symonds model obtained from experiment data, taking into the consideration of strain rate and temperature effect. Comparing with traditional elastic for...
Anisotropic conductive adhesive (ACA) flip chip interconnection offer many distinct advantages over the traditional solder flip chip interconnection. But the reliability of the ACA is still a concerned issue. There are many studies on this topic, and most of them studies only one physics field was include in analysis each time. In fact, ACA bonding is a complicated process involving multiple physics...
Thermal fatigue lifetime of the Fan-in Package on Package (FiPoP) was analyzed based on the plastic strain model by finite element analysis (FEA). Both the stress and strain of FBGA and PBGA solder joints were studied under thermal cycling. It was found that the outmost solder joint on the PCB was the most dangerous position. The fatigue lifetime for the key solder joint on the PCB was estimated using...
PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions...
Based on the theory of contact fatigue, the reason of pitting erosion and edge effect fringing of cam profile surface were analysed. And contact hertz stress between the cam and roller of fuel injection pump in some high strengthening and heavy duty diesel engine was calculated by using finite element software ANSYS, while the physical dimensions of roller were variable. After contrasting the results,...
In this study, three examples of failure analyses of electronic packaging by using the finite element method are presented. These are: (1) the failures (delaminations) near the interface between the filled copper and the silicon and between the copper and the silicon dioxide dielectric of the TSV of a 3D system-in-package (SiP) due to the local thermal expansion mismatch between the silicon and the...
Moisture properties such as moisture diffusivity and hygroscopic swelling have been carefully investigated for polymeric materials used on the MEMS-based pressure sensor. An improved TMA/TGA integrated method is used to characterize the hygroscopic swelling property. An analytical moisture diffusion solution is proposed to determine the moisture distribution and consequent hygroscopic induced strain...
A finite element model of the suspension structure of 9000 kN self-walking transporter was established, and the distribution of stress was simulated and calculated in order to determine the position of the dangerous point. Based on the actual working conditions and the results of FEM analysis, the reliability test of the suspension structure was done. The results of test are in good agreement with...
Based on the steel wheel bending fatigue bench test, the bending fatigue life FEA model for the wheel was established. The wheel fatigue regions got in FEA analyses matched the actual test results well. The works established a foundation for further study on wheel fatigue use FEA and provided a basis for the steel wheel's design and manufacture, which also can enhance the products reliability and...
The stress of Cu interconnects embedded in advanced ultra-low-k (ULK) dielectrics was studied for different porosities. Interconnects formed a high porosity material result in a lower stress due to relaxation in the plane. This effect is less significant for narrow lines, where in-plane relaxation is reduced by the dense narrow spacing. The stress in isolated lines was found to be independent of dielectric...
This study concerns the failure mechanism of a lead-free SAC305 solder joint under the isothermal bending fatigue condition. For this, series of bending fatigue tests are carried out with the variations of bending displacement and frequency, and FEM analysis is conducted to examine the relationship between mechanical behavior of a solder joint and fatigue life cycle. The results of this investigation...
Recently, drop test reliability has become a major concern for mobile electronic products. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased stress in solder joints during drop impacts due to their complicate structures. In this study, the evaluation of drop test reliability was performed for SIPs using modeling and drop test. 3D-dynamic nonlinear...
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