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The optimization of grinding parameters for silicon wafers is necessary in order to maximize the reliability of electronic packages. This paper describes the work performed to simulate a back grinding process for Through Silicon Via (TSV) wafers using the commercial finite element code ABAQUS. The grinding of a TSV silicon wafer with a thickness of 120 μm mounted on a backing tape was simulated. The...
The technological and economical pressures in manufacturing industry require an optimization of existing production processes. For this purpose, Thermal elastic-plastic constitutive equations are established to gain insight into the quenching operation of a production system. The finite element model is established to model transient 3-D temperature ad stress fields during quenching of the cone-shaped...
Shot peening is a cold working process which induces compressive residual stresses in near-surface layers and thus improves the fatigue strength of components. Shot peening involves the complex stress histories with stress reversals and cyclic loading conditions. In the study, using combined hardening model, the quasi-static simulations of the shot peening process are carried out with the help of...
Railway vehicle structures endured multiaxial fatigue loads in the service process, which aroused many difficulties for bogie frame's design and analysis. In this paper, firstly, the basic theory of multi-axial fatigue was explained. Secondly, the modeling methods of finite element analysis and stress state under standard loads were analyzed. Finally, three methods (maximum principal stress, Mises...
Local cover function in numerical manifold method based on natural (isoparametric) co-ordinates system is adopted, high-order stress mode and hu-washizu variational principles is used, quadrilateral manifold element shows good performance, the numeric results with high accuracy and insensitive to distorted meshes can be gotten.
Machining simulation and deformation prediction are effective approaches to improve machining error in processing thin-walled parts. However, the empirical studies are still insufficient to improve this problem. This paper uses the finite element method, through cutting process modeling, material removal modeling and calculating the initial residual stresses in machining process to predict and analyze...
Low Plasticity Burnishing (LPB), a mechanical surface enhancement technology was developed to produce a deep layer of highly compressive residual stress comparable to laser shot peening, but with minimal cold-work hardening, LPB produces the most thermally stable compression to hot sections of gas turbine engines made by superalloy like Inconel 718. Literatures detailing the experimental effects of...
The finite element software is often applied to stress analysis, which is also crucial to the design of anti-fatigue and anti-calcification of artificial heart valve. The material properties and the boundary conditions of bioprosthetic valve leaflets are defined and geometrical models are established. The linear material and the non-linear material of leaflets with different shapes are analyzed. After...
The closure of Multi-span continuous rigid frame bridge is one of important steps in its construction. The selection of closure scheme determines the deformation and stress state of the bridge when construction is completed. In this paper, based on the situation of Jing River Bridge, which is now under construction in Gansu Province, finite element method is applied to analyze and compare the inner...
Residual stresses on a machined surface are one of the crucial factors in determining surface quality. Residual tensile stresses can be harmful for a machined workpiece, such as fatigue life, corrosion and wear resistance, whereas residual compressive stresses field is usually considered to have a positive influence on these aspects. In this paper, the Arbitrary-Lagrangian-Euler finite-element method...
Deformational control is a critical problem for composite structures, especially for complex geometry composites. This paper presents a new anti-deformation compensation method to decrease the deformation for the polymer matrix fiber reinforced composite parts. The new method uses a mathematical model way, and includes a dimension predication model and an anti-deformation compensation model. The dimension...
The static and dynamic performance for the welded-structure column of a certain horizontal machining center is analyzed using the finite element analysis software ABAQUS. The stress, deformation distribution, natural frequency and mode of vibration of column under the different conditions are analyzed. The analytical results show that: the maximum stress is 2.40 MPa and the maximum distortion is 11...
Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 ??m, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic...
In this study, a truly meshless method is developed based on the integral form of equilibrium equations. This meshless method is formulated for generalized plane strain assumption with material discontinuity. In the absence of the body forces the domain integration is avoided, and so the computational time of presented method is reduced and presented method computationally is very effective. This...
Most current elastography methods remain qualitative or display only strain information due to the inexact internal stress distribution. A more accurate result may be obtained by employing force sensors to gauge the applied vertical compression force on skin surface through the ultrasound transducer. A computationally efficient superposition algorithm based on Love's closed-form equation (SLE) is...
According to the distributing characteristic of residual stresses in aluminum alloy plate, this paper adopted modified layer removal method (MLRM) to measure it; based on elastic mechanics theory the solving process was deduced. Using finite element method the process of MLRM was simulated, by loading specimen with a known original stress distribution the stress was worked out with strain datum from...
In this article, an intelligent optimization analysis method of residual strain for photosensitive resin is put forward based on the finite element analysis. With the methods of orthogonal experiment and radial basis Neural Network, the relationship of the residual strain and solidification technology parameters, such as circumstance temperature, illumination distance and illumination time, is established...
Window ball grid array (wBGA) package has become one of the most popular alternatives for DRAM packaging due to its high I/O density, high heat dissipation, low profile and high electrical performance. The reliability issue with excessive warpage of the wBGA packages, which results in solder joint failure during or after solder reflow process, or during thermal cycling, is needed to be resolved. To...
The failure mechanism of lead-free solder interconnections under thermal cycling has been studied by cross-polarized light microscopy, scanning electronic microscopy (SEM), and nanoindentation test. From the results of finite element modeling (FEM), it was found that the critical solder interconnection was located at the chip corner, and the stress was concentrated at the outer neck region beneath...
To study the interface stress of 63Sn37Pb under the temperature cycle condition in the QFP package. Viscoplastic finite element model is established based on the Anand constitutive equation. These factors are discussed in this paper, and these influent factors of the interface stress are between 63Sn37Pb weld spot and backing. The results show that the loading rate have very large effect on the interface...
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