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SiC-nanoparticle-mixed Sn58Bi solders were successfully produced by electroplating and the mechanical and microstructural properties of Sn58Bi+SiC solders were observed and analyzed in this study. Dispersed SiC nanoparticles by ultrasonic horn were added into Sn-Bi plating solution. With the SiC added Sn-Bi plating solution, solder bumps were electroplated. After electroplating, the solder bump specimens...
Bimetallic couples formed between commercially available lead-free alloys and selected contact materials were subjected to diffusion annealing using thermal gradients. Following diffusion annealing and aging, the contact interfaces were subjected to a detailed metallographic, scanning electron microscope (SEM), and energy dispersive X-ray (EDX) analyses. In addition, electrical resistance was used...
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