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Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. In this paper, mechanical properties of two...
Rubber material properties, and useful lifetime prediction and evaluation are very important in the design procedure to assure the safety and reliability of rubber components. We have been interested for many years in predicting the lifetimes of rubber materials in oxygen-containing environments using a combination of accelerated aging tests and extrapolation models. In this paper, we investigate...
Most semi-conductor devices are encapsulated by epoxy moulding compound (EMC) material. Even after curing at the prescribed temperature and time in accordance with the supplier's curing specifications often the product is not yet 100% fully cured. As a consequence, the curing process of a product continues much longer, leading to curing effects of the EMC during the lifetime of the package. In this...
SiC-nanoparticle-mixed Sn58Bi solders were successfully produced by electroplating and the mechanical and microstructural properties of Sn58Bi+SiC solders were observed and analyzed in this study. Dispersed SiC nanoparticles by ultrasonic horn were added into Sn-Bi plating solution. With the SiC added Sn-Bi plating solution, solder bumps were electroplated. After electroplating, the solder bump specimens...
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