The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the wire bond. The thermo-mechanical properties of these intermetallic compounds are crucial in the prediction...
Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. In this paper, mechanical properties of two...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.