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The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable...
We have developed a high-strength Ta-reinforced conductor for high-magnetic-field magnets. In our previous work, it was demonstrated that the Ta-reinforced conductor had good characteristics against mechanical stress and strain. In this study, we made a 2-D calculation code for a stress-strain analysis, and derived the stress and strain of the magnet using some physical values such as the Young's...
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