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In recent years high-speed electromagnetic repulsion mechanism (ERM), which is produced based on the eddy-current effect, has been widely applied to vacuum circuit breakers. One of the challenges for the design of ERM is to improve the speed of ERM by optimization design. In this paper, a novel co-simulation model is proposed. The related electromagnetic field, mechanical field and structural field...
This paper proposes a practical connection approach for distribution static synchronous compensator (DSTATCOM). DSTATCOM is connected to the system through a center-tapped distribution transformer for reactive power compensation. The voltage stress is reduced by half and the number of the cascaded cells is decreased. The mathematical model of the system is established referring to the autotransformer...
Printed circuit boards (PCB) are found in almost all electronic devices. During manufacturing and field operation, these PCBs are subjected to different loads, which cause stresses and deformations. Excessive stresses and deformations of PCB can lead to system failure. Thermo mechanical simulation helps to predict stress distribution in manufacturing and operational condition. PCB object consists...
A Physics of Failure (PoF) Reliability Assessment combines dynamic stress analysis of usage and environmental conditions with failure mechanism models to perform a durability simulation in order to identify failure susceptibilities and calculate reliability behavior over time. CAE Apps have been developed that automate PoF analysis tasks that allow non-CAE experts to perform expert level PoF evaluations...
We report on measurement and modeling of dynamic energy harvesters based on oscillating piezoelectric cantilevers, along with careful calibration of energy conversion properties of such devices in their dynamic responses. We employ thin-film lead zirconate titanate (PZT)-based cantilevers fabricated by laser micromachining, with efficient proof masses enabled by a heavy alloy with a low melting temperature...
Due to more build-in functions and smaller form factor requirements, mobile devices are required to have better thermal dissipation performance and thinner IC package profile. In this study, a new package which combines Cu pillar bumps with IC backside exposed-die properties is introduced. Compared with solder bumps, Cu pillar bumps can effectively increase substrate circuit layout density and then...
In recent years, the advancement of semiconductor technology has posted the demands of high integrity, high performance, mobility, and miniaturization onto measurement instruments. This trend is also prevailing on portable measurement and test instruments such as portable laser meters, portable laser levelers, handheld spectrum analyzers, palm-sized digital oscilloscopes, etc. Portable measurement...
This paper processes simulate analysis of short-circuit test model of transformer, using finite element analysis software ANSYS. The winding and disk deformation is calculated in different elastic modulus value of strip; The model is calculated and analyzed in the load of short-circuit test, the maximum deformation 2.62 mm of disk obtained is mainly consistent with actual measured value 2.9 mm; Analysis...
We propose a reliability model for describing the lifetime of devices and materials working under variable stress (i.e., stresses which are a function of time). The model is based on a two-parameter Weibull distribution obtained by retaining the leading term from a series expansion of a general cumulative hazard function. The scale parameter is related to the real-stress time evolution by means of...
Today, the reliability forecast is a new challenge for the electronic packaging industry. This paper deals with a 3 dimensional electro-thermo-mechanical modeling method for reliability studies of MOSFET transistor. This modeling method increases the accuracy of the thermomechanical computation. The dissipated power mission profile is computed with an electro-thermal co-simulation. The link between...
This paper presents the equivalent circuit model of PBG (Piezoelectric Bender Generator) along with its SPICE implementation. The model, made of lumped circuit elements, is valid under both parallel and series wired PBG operation modes. The model is validated by comparing the simulation results, from the transient analysis of the model in SPICE, with those obtained by using MATLAB??. An example using...
3D integrated circuit technology is an emerging technology for the near future, and has received tremendous attention in the semiconductor community. With the 3D integrated circuit, the temperature and thermo-mechanical stress in the various parts of the IC are highly dependent on the surrounding materials and their materials properties, including their thermal conductivities, thermal expansivities,...
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