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In general an IC needs to be assembled before being put on a microelectronics board by the end customer. The materials of which the IC is made and the materials for the assembly normally have different thermo-mechanical behavior. Temperature changes during manufacturing, testing and application will therefore cause stresses in the materials. These stresses, in extreme cases, may cause serious damages...
In this paper, the interaction between chip and package is investigated with the focus on low ppm-level failures. More specifically, the failure mode of inter-metal shorts is investigated, caused by either electrical discharges (ESD) or internal/external mechanical forces. It is demonstrated that forces induced by the filler particles in the molding compound can cause these shorts. Finite element...
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