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As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The interfacial reactions between (111) Cu single crystals and lead-free solders (pure Sn, Sn-0.7Cu and Sn-0.7Cu-0.1Ni) during solid-state aging at 150 °C were investigated in this study. The morphological evolution and the growth behavior of interfacial IMCs during short-period (0 to 100 h) aging process were studied. For the solders without Ni, the interfacial Cu6Sn5 grains displayed prism shape...
In this study, two kinds of microscale solder joints, Sn-0.3Cu/Cu and Sn-0.5Cu/Cu, were studied. The element diffusion behavior at the soldering interface was investigated as the bulk solder size various from 5μm to 100μm during HTS (High Temperature Storage) aging. Experimental results indicated that the size and shape of solder joints have a significant effect on the element concentrations at the...
The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface is investigated under aging temperature of 150 °C and aging time of 100, 300 and 500 hours. The relationship between the thickness of the IMC and aging time is fitted out, and the growth law of the IMC at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition is obtained. Mechanical properties of the Cu6Sn5 and Cu3Sn...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
In flip chip technology, Cu thin-film is a widely used under bump metallization (UBM). However, the major disadvantages of Cu UBM are fast consumption of copper, rapid growth of IMCs and easy formation of Kirkendall voids. Many efforts have been focused on suppression of Kirkendall voids which are detrimental to solder joints reliability in the microelectronics industry. In this study, a novel Cu(Mn)...
The current study revealed that the growth kinetics and the interfacial reaction of the Cu/Sn/Ag couples with different thickness solder. For the Cu/Sn/Ag couples, plate-type Ag3Sn was firstly formed at the Sn/Cu interface rather than at the Sn/Ag interface for the Cu/Sn/Ag couple at the initial state of the reflow procedure when the solder thicknesses is 150 μm or 300 μm. Besides, the microstructure...
In microelectronic packaging, the reliability of Pb-free solder joint is critically influenced by the interfacial reactions with under bump metallurgies (UBMs), and therefore controlling the intermetallic compound (IMC) formation and growth is recognized as a very important factor for improving the reliability of the solder joints. A silver (Ag) alloying element is broadly used in Pb-free solder alloys...
Ball grid array (BGA) solder interconnecting is one of the key technologies in electronic packaging and assembly. Legislation of lead-free process has made the application of lead-free solder become wider in electronic products. Compared to the lead-tin solder, the relatively higher melting points of most lead-free solders call for a higher reflow temperature. Thus conventional integral-heating process...
The changes of morphology and growth tropism of inter-metallic compound (IMC) and IMC growth rate at lead-free solders/Cu interface of solder joints often limit the reliability of the entire package during service. Furthermore, during thermal-shearing cycling process, the thickness of IMC at the interface grows significantly and growth tropism of IMC changes, resulting in in-service evolution of the...
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