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Ice storage systems (ISSs) are deployed in many cooling systems to shift cooling load from peak to low periods, and to enhance service reliability by backing up cooling capacity in case of shortage. To enhance the reliability of power supply, industry is considering using battery energy storage systems (ESSs) to provide backup power. However, the high cost of ESSs requests an efficient use of them...
In this paper, Spread Spectrum Time Domain Reflectometry (SSTDR) has been implemented for the first time across the gate and the source of a power metal oxide semiconductor field effect transistor (MOSFET) to perform the online degradation monitoring of switching devices as well as the overall converter. To accomplish this, the SSTDR test signal is superimposed with the pulse width modulated (PWM)...
For Smart Transformers (ST), reliability is one of the major problems when compared to the traditional low-frequency transformers. Modular ST with advanced control algorithms could increase the reliability compared to the non-modular solutions. This could be achieved by distributing differently the power among the cells depending on their aging. This unequal power transfer is a challenge for Cascaded...
Silicon carbide (SiC) power MOSFETs have been becoming a strong alternative to silicon (Si) technology in high-voltage, high-frequency, and high-temperature applications. Despite their growing market share, limited field information is available regarding the aging facts under thermal stress and long term reliability of discrete SiC MOSFETs. In this paper, discrete SiC devices are thermally aged through...
Coming with the reliability enhancement and the life extension for the Photovoltaic (PV) inverters modules, diagnostic techniques will be required to derive signature identification. The reliable operation of PV inverter is very crucial to get the highest performance for the long term. A new Smart Inverter Robustness Index (SIRI) is used for verifying the performance and robustness of the grid-tied...
This paper presents the joint Arrhenius-Weibull model as a new transmission line failure model as a result of operating under higher loading temperature due to DTR system application. The proposed model takes into account the effects of the line natural ageing (end-of-life) and its operation at higher loading temperature. The proposed model is compared with the conventional line ageing model that...
In order to elevate equipment-oriented traditional asset management to system-oriented advanced asset management (AAM) decision-making for smart power grid, for the problem that influence of different positions of the equipment in network topology on system reliability is not taken into consideration in retiring strategies of transformer LCC (life cycle cost), which may cause overestimation or underestimation...
In this contribution, impact of extreme environmental conditions in terms of energy-level radiation of protons on SiGe integrated circuits is experimentally studied. Canonical representative structures including linear (passive interconnects/antennas) and non-linear (Low Noise Amplifiers) are used as carriers for assessing impact of aggressive stress conditions on their performances. Perspectives...
An analysis of the degradation occurred in RF life-tests of n-type MOSFETs operated from pulsed bench for a radar application in S-band is introduced. The analysis comes accompanied with experimental results, which are used to facilitate optimization of the robustness of Power RF MOSFETs. The recorded S-parameters before and after degradation allows the observation of the corresponding changes in...
One important objective of the electromagnetic compatibility (EMC) studies is to make the products compliant with the EMC requirement of the customers or the standards. However, all the EMC compliance verifications are applied before the delivery of final products. Will the product still be EMC compliant during the lifetime? If not, what is the risk of non-compliance with EMC requirements, and how...
The Capacitive Micromachined Ultrasound Transducer (CMUT) technology has been under development for more than 20 years at Universities and industry labs. One of the major limitations for commercial use of CMUT probes has been poor reliability. Kolo Medical Inc. has developed a number of methods to improve reliability of CMUT probes. Kolo performed long term reliability tests to verify the improvements...
This paper deals with partial discharge measurements carried out on specimens of Type I and Type II insulation systems for rotating machines. Partial discharge (PD) patterns under sinusoidal and repetitive impulse voltage, considering two level and five level inverters, are presented showing that phenomenology is deeply different, but that increasing the number of inverter steps, PD patterns closer...
A framework to assess the reliability of an automotive motor controller with power electronics is presented in this paper. In specific, the significant power electronic device inside the controller, i.e., Insulated Gate Bipolar Transistor (IGBT), is modeled and its operation is simulated using the Matlab/Simulink tool. By computing its thermal behavior one can predict the impact of thermo-mechanical...
The simulation of aging induced degradation mechanisms is a challenging task during the design of digital systems. Parametrical degradations can be handled most accurately at TCAD level, as the physical models like [1] and [2] can be implemented directly. On the other hand, timing failures caused by such degradations cannot be assessed exactly lower than Register Transfer Level (RTL), where the notion...
For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
In this study, titanium (Ti) added Sn58Bi solder alloys were synthesized. Microstructure evolution and mechanical property change during 1008 h thermal aging were compared with those of eutectic Sn58Bi and Ti-added Sn58Bi alloys. According to the results, yield strength (YS) and ultimate tensile strength (UTS) decreased, while even after aging, the Ti-added Sn58Bi alloy maintained the highest YS and...
The SnSbNi solder pastes were reflowed at 270°C and 280°C between the MvpLED chip and the AlN ceramic substrate, and then the SnSbNi solder joints were aged respectively at 200°C for 1h and at 250°C for 3h. The interfacial microstructure and constituents were investigated by SEM and EDS. After the reflow reactions, a thin layer of IMCs was formed at the chip/solder and solder/substrate interfaces,...
As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
Distribution System Operators (DSO's) in the Netherlands are generally more focused on Medium Voltage (MV) grids than on Low Voltage (LV) grids as higher voltage levels contribute more to the SAIDI. However increasing interruption times, increasing costs and the energy transition on LV level encourage the DSO's to focus on LV grids as well. A first step is the investigation of failures in LV grid...
The paper is devoted to the climate influence on the safety of a critical infrastructure defined as a complex system in its operating environment that in the case of its degradation have significant destructive influence on the health, safety and security, economics and social conditions of large human communities and territory areas. The method based on the joint model linking a multistate approach...
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