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This paper presents Finite Element Analysis of a horizontal monometallic thermal actuator for MEMS application with three different materials namely Single Crystal Silicon, Poly-Silicon and Titanium. It is aimed to predict the suitability of the three materials for the actuator. Using the software COMSOL™ Multiphysics 3.5, deflection, stress and temperature analyses are carried out, for a range of...
Thermal simulation of a stack consists of three IC layers bonded ??face up?? is performed using finite element modeling. Significant reduction of ~62??C in maximum chip temperature is predicted by inserting an electrically isolated thermal through silicon via (TTSV) having Cu core and oxide liner shell that extends across IC layers to the substrate. The effects of TTSV dimensions and its extension...
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