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While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced thermal gradients can be high enough to create undesirable stress in the ICs, undermining the structural reliability and lifetimes. In this paper, we...
The rapid increase in on-chip heat fluxes and package heat density, accompanying the migration to nanoelectronics and 3D chip stacks, has placed thermal management squarely on the critical path for advanced product development. Innovative, cost-effective cooling techniques, combined in a synergetic way with more conventional approaches, must be developed if the benefits of the Moore's Law progression...
Thermal performances of 3D stacked TSV (through silicon via) chips filled with copper are investigated based on heat-transfer CFD (computational fluid dynamic) analyses. Emphases are placed on the determination of (1) empirical equations for the equivalent thermal conductive of chips with various copper-filled TSV diameters, pitches, and aspect ratios, (2) the junction temperature and thermal resistance...
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