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The traction-displacement relations of the epoxy-copper interfaces are studied using an atomistic model. The reaction force of the epoxy layer in response to displacement of the interface is calculated during molecular dynamics simulation. A parametric study in terms of displacement rate and the step size of displacement increment has been performed. The traction-displacement relations are found sensitive...
By using the PAGE (Poly Acrylamide Gel Electrophoresis), the effect of water-borne Cu2+ on the isozymes in gills of E. sinensis was studied. The experimental groups were treated with different concentration of Cu2+ as 0.01, 0.10, 1.00, and 5.00 mg/l, respectively. The results showed that different isozymes had specific responses. The activity of LDH and MDH decreased gradually along with the increasing...
The behavior and fate of copper binding with extracellular polymeric substances (EPS) from activated sludge, under simulating bio-calcification, was studied. Results showed that the degree of EPS sequestering with calcium had a strong differential affect on copper sorption. At lower Ca2+ concentrations (≤80 mg·l-1), the Langmuir equation was able to model adsorptive processes between Cu2+ and EPS,...
Superfill (bottom-up) phenomena relevant for Damascene processing typically rely on the time-dependent interplay of various organic and inorganic additives with both the metallic copper surface and with cuprous ions as intermediates of the copper electro-reduction in the near-surface regime. In-situ STM, in-situ SXRD (Surface X-Ray Diffraction) measurements combined with DFT calculations provide new...
Photovoltaic devices fabricated from blends of copper indium sulfur (CIS) and poly (3-hexylthiophene) (P3HT) are demonstrated and cell performance is measured. The CIS material was made into nanocrystalline particles by polyol route. Both fabrication processes and parameters are adjusted to achieve optimal cell performance. These include selection of four different solvents used for dissolving both...
The current paper applies both molecular modeling and mesoscale modeling to determine modulus and defect formation in epoxy and epoxy-copper interfaces. The results will show that molecular modeling may be applied directly to parameterize the bead properties used in the mesoscale model, which scale to the physical properties.
A microstrip patch antenna (MPA) has been fabricated using a conducting polymer (CP), polypyrrole (PPy) as radiating patch on a transparent 3 mm thick PlexiglasTM substrate. The bulk DC conductivity of the PPy patch is 2000 S/m and its thickness 120 μm. The MPA was designed for operating at 2 GHz. A similar antenna with copper (Cu) patch on PlexiglasTM was also fabricated for validating the simulation...
Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned...
Palladium nanoparticles were synthesized simply by reducing Pd ions which were attracted to electron nitrogen atom in poly(N-vinyl-2-pyrrolidone) (PVP). This Pd/PVP aqueous system was developed as the activator for electroless copper deposition. Compared with commercial Pd/Sn colloid that was easily oxidized by dissolved oxygen and agglomerated in the solution, Pd/PVP activator was stable without...
In this paper we demonstrate functional 3D circuits obtained by a 3D Stacked IC approach using Die-to-Wafer Hybrid Collective bonding with Cu Through Silicon Vias (TSV). The Cu TSV process is inserted between contact and M1 of our reference 130 nm CMOS process on 200 mm wafers. The top die is thinned down to 25 mum and bonded to the landing wafer by a combination of polymer bonding and copper to copper...
Piezoelectric poly(vinylidene fluoride - trifluoroethylene) copolymer is embedded as a functional material in a table-tennis racquet. Together with the developed electronics, this piezoelectric sensor is able to monitor the position where the ball contacts the racquet. In order to build up the device, conventional circuit boards with adapted electrode structures are used as substrates for the piezoelectric...
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning during the solder reflow of plastic-encapsulated IC packages is a frequently occurred defect due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of plastic packages. To improve package reliability...
The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes...
The copper heavy metal wastewater does lots of harm to people and it is difficult to deal. Using flocculant to treat copper wastewater has a lot of advantages. Under certain conditions proceeded modification of a kind of clay which has the unique characteristic of absorbability. Then the modification clay and the polymerization iron carbonyl ion can play polyreaction, to innovate a new type of macromolecule...
A novel fabrication process is presented that uses liquid crystal polymer (LCP) film with copper filled thermal vias to construct a flat micro heat pipe (MHP) suitable for thermal management of semiconductor devices. LCP is chosen for its high chemical resistance, reliability, flexibility, and its ability to be readily incorporated into current mass production technologies. Copper filled thermal vias...
We report on the use of the diamond bit cutting technique in the fabrication of polymer embedded Cu interconnects. This fabrication technique is an attractive alternative to standard patterning techniques used to fabricate such interconnect structures e.g. lithographic, dry etching or laser patterning.
Embedded capacitor technology is an essential method for miniaturization and high performance of electronic package systems. High dielectric constant epoxy/ceramic composites have been of great interest as embedded capacitor materials because they have good processability, compatibility with printed wiring boards (PWB), and high dielectric constant. In previous works, epoxy/BaTiO3 composite embedded...
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
Embedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more features, smaller size and lower cost demand smaller, compact, simpler substrates. An obvious strategy is to reduce the number of surface mounted passives...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
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