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Due to the harmonics produced by inverter supply, the distribution characteristics of rotor copper and iron losses become more complicated in the inverter-fed induction motor (IFIM). To study the distribution characteristics of rotor copper and iron losses of the IFIM, we propose a new method to identify the harmonics of current density in the rotor bar and flux density in the rotor core using one...
The paper describes a 3D semi-analytical harmonic modeling technique, which is capable to model eddy current distributions in conducting structures and the associated fields. The induced current density and magnetic fields in the spectral domain are described, where a spatially varying conductivity of a conducting region is incorporated in the solutions of magnetic-field quantities. An experimental...
With the strength of fine pitch, high electrical conductivity and excellent reliability, copper pillar interconnect becomes a promising alternative to traditional solder bump. However, bad surface smoothness is a severe problem and significantly affects the reliability of the bump connection. In this paper, numerical simulations on the shape evolution of copper pillar bump and the effect of bump dimension...
In order to study the electromigration characteristics of the butting solder joint in microelectronic packaging devices, this paper designs a Cu/Solder/Cu electromigration experiment to observe the change of the microstructure of the interface by scanning electron microscopy (SEM). It is found that the evolvement of the IMC at anode follows a parabolic growth rule under the condition of electric current...
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test chip with electrified daisy chain copper pillar bumps was designed and manufactured. And 9 sets of thermoelectric coupling accelerated life test were carried out respectively, which the resistance increased by 10% was considered as the failure threshold to get the mean-time-to-failure...
Wound components typically represent approximately 50 % of the total mass of a power converter, consequently minimising the mass and volume of transformers and filter inductors is an important challenge in the design of compact power dense converters in transport and other demanding applications. The research described in this paper contributes to a body of work investigating design tools and new...
Nowadays, copper bump is often used in driver IC which usually used in high current density environment. High current density leads to electromigration. Therefore, the main objective of this paper is reliability analysis, including observing the changing by electromigration in copper pillar bump with different magnitude of current and temperature. Use gridding and Scanning Electron Microscope (SEM)...
Demand for compact high torque/power density electric machines necessitates the choice of an effective cooling system. The focus of this paper is to compare the steady-state thermal analysis of a naturally air-cooled conventional 8/6 SRM to the same motor with direct in-winding cooling system. The goal is to determine how much torque increase can be achieved by using direct cooling in the windings...
Copper electroplating is a critical step in the fabrication of reliable High Density Interconnect (HDI) substrates intended for use as core layers in build-up applications. HDI substrates may contain vias and through holes having several different dimensions that make it challenging to meet via filling and hole throwing power (TP) requirements. A next generation Electrolytic Copper plating process...
Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density...
In this paper, we studied the current carrying capacity of solder joints in the Copper Column Grid Array (CuCGA) by means of finite element method (FEM). The current carrying capacity of solder joints can be reflected by the peak value of the temperature and current density. And the solder fillets were the critical region in the entire CuCGA. Therefore, the paper mainly studied the influence of the...
A model of copper and carbon nanotube (CNT) composite filled in through silicon vias (TSV) is developed to determine the electrical behavior of an emerging 3D interconnect technology. The copper/CNT composite is configured in a TSV structure to enhance electrical and mechanical interconnect properties. The TSVs are fabricated in a deep reactive ion etching process that produces tapered sidewalls which...
In this research a modeling, design and analysis of the most suitable dimensions and the number of turns of the induction coil required for a certain brazing process was done by using FEM. Ansoft Maxwell computer package is used for this purpose. The simulation determines the electromagnetic field distribution inside the work coil by the required excitation current and frequency. Then the optimal...
Four level sets of current density and additive concentration are used to electroplate copper into the through silicon via to prepare four sets of test samples. Each set of samples are annealed at 425°C for 30min. The Cu-Si interface of the TSV structure and the copper microstructure are observed before and after annealing, and the copper protrusion is measured after annealing. Effects of the electroplating...
Electroplating Cu technique becomes more and more important in advanced three-dimensional integrated circuit (3D-IC) packaging because of its advantages in the electrical/thermal conductivity, low cost, and hole-filling performance. Formula of the Cu electroplating solution, especially the additive like suppressor, accelerator, and leveler, plays a crucial role in the electroplating process. Previous...
Globalization, industrialization, mining, and uncontrolled population growth have fostered a shortage of potable water. Thus, it has become imperative to understand an effective and reasonable water purification technique. A renewed interest in electrocoagulation has been spurred by the search for reliable water-treatment processes. This paper has elucidated a technical approach for getting rid of...
In this paper, the main purpose is reliability analysis. To find what kinds of environment will impact the inner structure of sample. Two of the objective is emerged from this study. First, electro-migration in sample under high current density has become a critical reliability issue. Carry current density test is to probe the failure phenomenon of electro-migration on inner structure. Then compare...
Air pollution usually has many sources, such as automotive emissions, heavy industrial emissions, volcanoes, landfill sites and so on. Severity levels of air pollutant rich in oxides, chlorides and sulfurs can cause severe corrosion on electronic equipment. With the more and more severe environmental pollution, especially in developing countries, the air quality will also directly or indirectly influence...
The performance of copper electrowining process is directly linked to the electrode's hanger bar designs and plate assembly methods. The actual physical condition of the plate — hanger bar assembly and the internal resistance of electrodes are critical factors for electrowining practice. Electrode internal resistances affects parallel anode-cathode pair resistances, and correspondingly, balanced copper...
A novel DC blind micro via filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range. The process will be commercialized and it is anticipated that there will be substantial future growth in adoption of this technology to fill blind micro vias. This new chemistry in combination with...
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