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The large range of length scales present within accelerator magnets suggests the incorporation of a hierarchical structure into computational models. Evaluation of the strain state present within the superconducting filaments is necessary in order to determine the critical current of based magnets. As part of an ongoing investigation at LBNL, a three-dimensional nonlinear multiscale...
The development cycle of new products can be dramatically reduced if exact lifetime models are at hand. This requires the precise knowledge of the failure modes and the failure position under all test and service conditions. In case of dynamic mechanical loads like drops of BGA modules, broken copper traces at the PCB side are more and more often observed to be the ultimate failure effect. However,...
A simulation of the Board Level Drop-Test is performed to evaluate some WL-CSP (Wafer-Level Chip-Scale Packages) performances. An elastic-plastic model is applied on both solder bump and copper pad materials. It intends to demonstrate that copper plasticity is mandatory due to the large plastic strain occuring in these materials. A statistical analysis discusses the required accuracy for the modeling...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
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