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This paper shows a practical approach to GaN-based HEMT self-consistent electro-thermal simulation for circuit modeling and reliability estimation. A physical-level lumped element dynamic thermal network able to describe the two-dimensional device geometry is self-consistently coupled with an electro-thermal compact large-signal model. The results obtained with the lumped-element thermal network are...
This paper described a ceramic ball grid array (CBGA) and its second level reliability. The CBGA uses a substrate with high coefficient of thermal expansion (CTE) and leadfree soldering. The reworkability of the BGA package and board was also studied. The results have shown that this package is reworkable without a significant reliability reduction in the board level reliability. The reliability of...
PoP is a potential solution to high-speed memory packaging. For PoP package, warpage is known as a concern over package stacking and SMT yield. The PoP package under current study has these features such as fine pitch which is 0.5 mm for both top and bottom, small ball size and that most solder balls are located at the packagepsilas two longer edges. Therefore the solder joint reliability (SJR) in...
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