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In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress models. The transient moisture absorption and desorption analysis were performed to estimate the package moisture distribution...
Moisture properties such as moisture diffusivity and hygroscopic swelling have been carefully investigated for polymeric materials used on the MEMS-based pressure sensor. An improved TMA/TGA integrated method is used to characterize the hygroscopic swelling property. An analytical moisture diffusion solution is proposed to determine the moisture distribution and consequent hygroscopic induced strain...
Chip-Package interaction (CPI) has drawn much attention for very low-k (VLK) packaging technology development, especially as the electronic industry is moving from SnPb solder to lead-free solder. In this study, a multi-level finite element model is used to optimize the interconnect scheme from a packaging reliability point of view. Factors including top metal (or SiO2) thickness, passivation dielectric...
With the increased complexity of SiP (system in package), Finite Element simulations take an important role in predicting the thermo-mechanical package reliability. Failures in flip chip packages such as die cracking and fatigue of solder bumps are specially the result of the mismatch in thermal expansion coefficients between die and the substrate. In some packages, we use an underfill to improve...
Reliability is one of the important problems in electronic packaging, which affects the use and life of the products. In this paper, we present a high power SiC-based light-emitting diode (LED), the thermal, mechanical and optical performances were investigated respectively. Heat dissipation performance and junction temperature were obtained using finite element analysis (FEA), the influences were...
PoP is a potential solution to high-speed memory packaging. For PoP package, warpage is known as a concern over package stacking and SMT yield. The PoP package under current study has these features such as fine pitch which is 0.5 mm for both top and bottom, small ball size and that most solder balls are located at the packagepsilas two longer edges. Therefore the solder joint reliability (SJR) in...
This paper devotes to the fatigue damage analysis of a solenoid tube under vibration-induced fatigue stresses and is concerned with the estimation of tube reliability from variable amplitude stress histories in the time domain. The complete procedure of reliability assessments for the tube fatigue failure has been presented in this paper. The fatigue strength of the tube material was represented by...
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