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Deterministic approaches may predict the life of solder joint interconnects used in microelectronic devices far different from the test results and field environment. This difference is caused by uncertainties introduced in finite element and damage modeling with different random variables such as material properties, geometry, damage model constants, and many others. This paper presents a methodology...
As far as components with flip chip interconnects are concerned, one of the popular packaging solutions available in the market is thermally enhanced flip chip ball grid array (TEFCBGA) packages, which target mid to high performance applications. Traditional as it may be, the development of a reliable TEFCBGA package is still a very challenging task. The demands for high electrical performance with...
This paper described a ceramic ball grid array (CBGA) and its second level reliability. The CBGA uses a substrate with high coefficient of thermal expansion (CTE) and leadfree soldering. The reworkability of the BGA package and board was also studied. The results have shown that this package is reworkable without a significant reliability reduction in the board level reliability. The reliability of...
In this paper, the fine pitch ball grid array (FBGA) assembly with lead free solder was tested under thermal cycling condition. Finite element modeling and simulation was conducted. The microstructure designs of via in pad of substrate and through hole (via) in PCB under the solder joint were simulated. The solder mask definition (SMD) and non-solder mask definition (NSMD) on PCB board side was also...
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