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This paper introduces a concept for a reliable and miniaturized power control unit (PCU). With this PCU, an electro-mechanical actuator (EMA) is controlled. This EMA is intended to be used in a swashplateless helicopter control system. As this is a safety relevant part of the helicopter, the PCU needs to work reliably under challenging ambient and operating conditions. At the same time, the whole...
In flip-chip solder joints, Cu has been used as a under-bump metallization (UBM) for its excellent wettability with solders. In addition, electromigration has become a crucial reliability concerns for fine-pitch flip chip solder joints. In this paper, 3D finite element method was employed to simulate the current density distribution for the eutectic SnPb solder joints with 5 mum, 10 mum, and 20 mum...
The integration of Cu metallization with porous ultra low-k dielectrics requires a more robust diffusion barrier than the conventional physical vapor deposited (PVD) Ta or TaN barrier. In this work, a composite sidewall diffusion barrier consisting of dielectric/metal bilayer structure is successfully integrated in Cu/porous ultra low-k interconnects to improve the interconnect performance and reliability...
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