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In flip-chip solder joints, Cu has been used as a under-bump metallization (UBM) for its excellent wettability with solders. In addition, electromigration has become a crucial reliability concerns for fine-pitch flip chip solder joints. In this paper, 3D finite element method was employed to simulate the current density distribution for the eutectic SnPb solder joints with 5 mum, 10 mum, and 20 mum...
We report a case study for the optimization of a flip chip based stacked die array test package. We demonstrate the importance of package substrate design and substrate thickness on the processibility and package warpage control. We found that for thin substrates copper balancing of the top and bottom die is crucial. We show the impact of flip chip die thickness and substrate thickness on the die...
This paper describes a study of solder joint shape evolution and its effects on the fatigue behavior of multi-copper-column flip-chip interconnects. Surface evolver has been used for the solder joint prediction in terms of different solder-copper wetting angles and the number of copper column per interconnect. A systematic procedure has been developed to integrate the solder shape prediction with...
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